Schlegel EMI - Shielding Gaskets | Thermal Interface Materials

OpTIM^® OP-8200 Spec 06

14W/mK Thermally conductive filler, now available!

Conforms to surface irregularities under low application pressures
RoHS Compliant and Halogen-free

Learn More

DoubleShield Grounding Pads

Expands SEM elastomer line to meet customer needs
Ensures electrical performance without breaking throughout the lifetime of the product
Pick and place directly onto the board

Click Here

PolyFab^®

• Foam, PP, TPE and dual extrusion gaskets

• Perfect for weatherstripping and sealing products needs

• Highly-engineered embossed polyethylene liner

• Polypropylene thermoplastic elastomer availability

Click Here

TIMSorb^® Thermal / EMI Absorber

NEW! TIMSorb^® hybrid absorber tackles the increased demand for thermal management!

The dual-functional line features:

OP-7400 a hybrid absorber/thermal management material
OP-7500 a premium grade thermal conductivity
OP- 7600 the best of both worlds

Click Here

OpTIM^® OP-8200 Spec 06

14W/mK Thermally conductive filler, now available!

Conforms to surface irregularities under low application pressures

RoHS Compliant and Halogen-free

Learn More

Fabric Over Foam

Our premier technology. The core of our product line.

Search Drawings

Elastomers

Silicone shielding capabilities that combine EMI shielding with environmental sealing, for demanding applications.

View Gaskets

Absorbers

Elastomer Cavity Resonance (BandSorb^® SC) Absorbers . Low cost solution providing absorption across a wide range of frequencies.

Learn More

Thermal Interface Management

Maintain the life and reliability of heat-generating electronic components.

Learn More

Conductive Foam

Conductive Tapes

HCVP

Fingerstock (BeCu)

Thermal

Schlegel Electronic Materials Recognized as 2025 Top Advanced Materials Solution Provider

Apr 15, 2025

Ensuring the reliability and performance of electronic systems is key in today's rapidly evolving technology landscape. Schlegel Electronic Materials (SEM) stands at the forefront of this challenge, offering...