The Right Shielding Product for Die-Cut I/O Applications
Simultaneously, these electronic devices are sensitive to various susceptibility requirements, including electrostatic discharge (ESD, e.g., IEC 61000-4-2). In some cases, these devices must resist applied voltages as high as 15 kV. In this instance, the same shielding materials must also feature an extremely low impedance/resistance at very low frequencies to ensure a harmless discharge path exists to allow the charge to flow from the I/O connectors to the exterior of the chassis, and then safely away from the devices.
Schlegel Electronic Materials, Inc. (SEM) introduces ORS-II, a new series of gaskets specially designed for broadband applications. By combining its famous nickel copper plated conductive foam and its high-end nickel copper C12 flexible fabric cladding, ORS-II offers minimal surface resistance to achieve superior grounding and shielding results at low frequencies.
By offering excellent Z-conductivity to close the cavities in the chassis openings, ORS-II also ensures substantial shielding performance at high frequencies. ORS-II is available in a variety of thicknesses, which are die-cut to customer specifications for a durable highly conductive product in all X-Y-Z axes. In addition, shielding efficiency is achieved with less sensitivity to compression variances than other traditional shielding products. ORS-II is available with a UL94-V0 flammability rating and complies with RoHS 2.0 European Directive and SVHC Policy (REACH).
All these features combined in one product makes ORS-II a great engineering solution when addressing all types of shielding challenges which are present in broadband and high-speed applications.
ORS-II is available in a multitude of geometries and in varying thicknesses. ORS-II is recommended for all combinations of I/O connectors, is particularly effective when broadband emissions and/or susceptibility are of concern, and is far more effective than standard conductive foam when superior grounding is important.
|See Graph||Stripline method (IEEE std 1302)|
|Operation Temperature||-40°F +156°F (-40°C +70°C)||UL94|
|Surface Resistivity|| <=0.024 ohm/sq. : NiCu-C12|
<=0.08 ohm/sq. : NiCu-C22
|SEM LP 3004|
|Compression Set||<15% (compressed at 50% during 22 Hrs. @ 70 ?)|
| Contact Resistance|
| <0.08 ohm-inch: NiCu-C12|
<0.20 ohm-inch: NiCu-C22
|SEM LP 3001|
|Abrasion Resistance||1000 cycles||ASTM D3884|
ORS-II Part Number Guideline:
CC3EXXXX – ORS II
CC3E: Die-cut according to customer drawing
XXXX: Sequence number
Shielding effectiveness of ORS-II versus current shielding materials