Grounding pads, also known as surface mount gaskets or board pads, ensure electrical performance without breaking under mechanical or environmental stress throughout the lifetime of the product. Schlegel’s Doubleshield Pad ensures reliable grounding performance in electronic applications. The Pads are delivered in tape-and-reel packaging for automated placement and soldering reflow using standard SMT equipment.
Features and Benefits
The flexible and easily compressible grounding pad can to take up tolerances and close the gap between a PCB and another component in addition to providing a reliable grounding contact.
- SMT compatible
- Excellent mechanical properties
- Large conformable contact area
The Doubleshield Pad is used as a grounding contact on printed circuit boards commonly used in the electronics industry.
The Doubleshield Pad has a hollow profile with a core of soft silicone and a shell of electrically conductive silicone rubber filled with Ni/C particles.
The product is laminated with a solderable metal strip in Nickel alloy 201.
The Doubleshield Pad is delivered in three different versions but different cross sections and lengths can be developed to fit any demand.
The recommended operating temperature is between -55°C and +125 °C. To assure a safe and repeatable compression Schlegel recommends the use of mechanical compression stops allowing a compression degree of 20 – 25%. A minimum 10% and maximum 50% compression is recommended.
The Schlegel Doubleshield Pad fulfils the requirements set by the Directive 2011/65/EU and its amendments (RoHS).
The compression force versus compression degree is shown in the graph below.
The electrical resistance versus compression degree is shown in the graph below.
The Doubleshield Pad is packaged and delivered in tape-and-reel.
The product has an MSL-1 rating (unlimited storage time) as the grounding pad is delivered in a sealed plastic bag. This assumes that the storage is indoors to protect the product from rain and direct sunshine and at a temperature between 5 and 30°C and a relative humidity of 20-80%.
The information provided in this document is only a guide and not a specification. The recommendations and data given are based on our experience to date, however, no liability can be assumed in connection with their usage and processing.