OP 8400 Spec 09 is a performance-improved derivative of the original OP 8400 gap pad. It is exceptionally soft and exhibits good thermal performance. It is compliant to RoHS standard while maintaining its
halogen-free status. These special features are benefited from the proprietary composition of metal oxide fillers in its binder matrix.
It is electrically non-conductive and naturally tacky. Additional adhesive is generally not required.
Typical Applications
• Between a transistor and a heat sink
• Between two large surfaces such as an
L-bracket and the chassis of an assembly
• Between a heat sink and a chassis
• Under electrically isolated power
modules or devices such as resistors,
transformers and solid state relays
Optional Configurations
• Can be die-cut into specific dimensions
| Color | Pink |
|---|---|
| Thickness Range [inch/(mm)] | 0.008” (0.20) ~ 0.02” (0.50) |
| Thermal Conductivity [W/mK] | 2.5 |
| Hardness [Shore 00] | 70 |
| Operation Temperature [°C] | -60 – 200°C |
| Halogen-Free [under 700ppm] | Yes |