Description
Features and Benefits
- 2.0W/m-K thermal conductivity
- Good compressibility
- Non-silicone gap pad
- RoHS compliant
- Halogen-free
Typical Applications
- Silicone sensitive devices
- Power conversion equipment
- Cooling components to the chassis, frame or other types of heat spreader
- Wireless communication hardware
- Automotive control units
- Power supply
- Audio and video component
- Micro processor
Optional Configurations
- Can be die-cut into specific dimensions