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As today's electronic devices become faster and more fully featured, achieving electromagnetic compatibility (EMC) becomes increasingly challenging. One of the world's leading computer manufacturers knew this when it asked Schlegel Electronic Materials (SEM) to design shielding for the I/O ports in the company's new line of personal computers.
SEM was the first company to develop I/O gaskets from a soft, resilient fabric and foam combination that has been used in everything from small D-SUB connectors to large arrays in telecommunications cabinets. In this case, the surface area of the connector array requiring shielding - 7 inches long by 2.5 inches high - was relatively large and included a number of openings. In the past, the computer manufacturer would have employed stamped metal shielding. With today's increasingly powerful machines, however, stamped metal shields do not provide sufficient shielding integrity. Metal shielding can also have sharp corners that can snag during installation or prove hazardous to installers.
SEM's flexible, resilient I/O shielding gaskets combine highly conductive metalized fabric around a soft and resilient urethane foam core. With millions of contact points, and a perfect mechanical fit, the conductive gasket makes 100-percent contact with the surface, outperforming such alternative shielding methods as stamped metal, Beryllium copper and other conductive elastomeric shielding products.
Other advantages of SEM I/O shielding gaskets proved to be: Low-cost prototypes compared to those produced by metal stamping Custom die cutting and finishing options Low tooling cost Lightweight and high resiliency facilitated shipping worldwide to subcontractors Fast, easy and safe installation.
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Technical Overview:
• Wider Profile
I/O Gaskets
• Design Flexibility
• Conductive Silver
Tape & Notebook Design
• Eu directive
on RoHS & WEEE
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